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  • Microsystems technology

    Precision measurements in micro-drilled holes

    In co-operation with: Schmoll Maschinen GmbH / Impex Leiterplatten GmbH

    Test objects:

    Micro-drilled holes (microvias) in multi-layer circuit boards

    Relevant parameters:

    Copper layer position, hole depth and surface quality (roughness)

    Metrological challenge:

    very small hole diameters (≥ 0.6 mm) that cannot be accessed using conventional measuring devices due to their size and thus cannot be inspected; Goal: non-destructive, 100-percent inspection during production

    Solution:

    FDM-2 precision fiber-optic measuring system with miniature probe (Ø 125 µm)

    A precise plated through hole is critical to the quality and functionality of multi-layer printed circuit boards. As such, the ability to precisely determine the depth of each copper layer during production is important in order to avoid contact dislocation and faults.

    A non-destructive inspection of the layer position is difficult with PCBs with micro-drilled holes, as the diameter of these microvias is in the micrometer or low millimeter range. Conventional measuring devices are unable to enter the micro-manufactured spaces due to their size. Because of this, quality control has been thus far performed using techniques such as micrographic inspection.

    In order to perform a non-destructive, production line 100% inspection of the holes, fionec further developed its FDM-2 fiber-optic distance measuring system to accept miniaturized probes. The micro-probes have a diameter of just 125 µm and can contactlessly scan the individual layers at measuring speeds of up to 10 kHz and accuracies in the sub-micrometer range.

    In addition to precisely determining the layer position, the FDM sensors can also record parameters such as surface roughness or hole depth.