Precision measurements in micro-drilled holes
In co-operation with: Schmoll Maschinen GmbH / Impex Leiterplatten GmbH
Micro-drilled holes (microvias) in multi-layer circuit boards
Copper layer position, hole depth and surface quality (roughness)
very small hole diameters (≥ 0.6 mm) that cannot be accessed using conventional measuring devices due to their size and thus cannot be inspected; Goal: non-destructive, 100-percent inspection during production
FDM-2 precision fiber-optic measuring system with miniature probe (Ø 125 µm)
A precise plated through hole is critical to the quality and functionality of multi-layer printed circuit boards. As such, the ability to precisely determine the depth of each copper layer during production is important in order to avoid contact dislocation and faults.